Memorandum of Understanding Signing Ceremony Between University Malaya and LCP Buildsoft Technology (M) Sdn Bhd.

Is a new milestone for us to support the local university for 2 purposes:

1. Let students have chances to expose to industry for real working experience & project experience before students graduate.

2. To explore more R&D system development by getting different skills/knowledge from different professors in different faculty department.

This is a new remarkable journey for LCP Buildsoft Technology (M) Sdn Bhd where we are proud that we can contribute back to the community, especially since this year is our 10 years anniversary!

Cheers! And we will keep providing the latest technologies by helping the community or company to digitalize!